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Samsung To Leverage PC Tech To Prevent Exynos Chip Overheating

Team Gossip  |   Jul 6, 7:23 AM   |   6 min read

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Highlights

  • Samsung’s Exynos 2400 is a respectable flagship processor, but there have been some complaints about it getting a little hotter than the Snapdragon 8 Gen 3.

  • Now, it looks like Samsung has a new cooling solution up its sleeve for future Exynos smartphone chipsets.

  • Samsung is working on a new chip packaging technology called fan-out wafer-level package-HPB (FOWLP-HPB).

Samsung’s Exynos 2400 is a respectable flagship processor, although there have been some complaints about it getting a little hotter than the Snapdragon 8 Gen 3. Now, it looks like Samsung has a new cooling solution up its sleeve for future Exynos smartphone chipsets.

 

The Elec reports that Samsung is working on a new chip packaging technology called fan-out wafer-level package-HPB (FOWLP-HPB). This tech involves attaching a type of heatsink, called a heat patch (HPB), to the top of the chipset.

 

Also Read: CMF Phone 1 Launch Slated For July 8; Here’s What To Expect

 

Samsung To Use PC Tech For Its Mobile Chipset

 

According to the report, the heatsink technology is derived from PCs and servers and is expected to be used on future Exynos processors. The website added that the tech is only arriving on phones now because of their small form factor, hinting that miniaturizing the tech wasn’t easy.

 

It's believed that the development of the tech will be completed by the end of this year, opening the door to mass production. This timeline suggests that the Exynos 2500, expected to be used in some Galaxy S25 models, could be packed with this cooling tech provided that development wraps up in early in the last quarter of 2024.

 

The Exynos 2400 ran a little hotter than the Snapdragon 8 Gen 3. Meanwhile, 2022’s Exynos 2200 fared even worse, featuring major throttling issues. So this packaging tech would be a good addition to future Exynos chips if it works as expected, making way for more consistent performance, better battery life, and cooler phones.

 

Also Read: Google To Finally Fix Fingerprint Scanner Issues With Pixel 9

 

Samsung Launches 3nm Exynos W1000 For Watch 7 Ultra

 

Samsung is all set to unveil its next-generation products -- Galaxy Z Fold 6, Galaxy Z Flip 6, Galaxy Watch 7 series, and the Galaxy Buds 3 -- at the company’s Galaxy Unpacked event in Paris.

 

The company, ahead of the event, has launched a new chipset -- Exynos W1000 -- that is said to power the next generation of Galaxy smartwatches and wearables. Going by the leaks and speculations, the Exynos W1000 is expected to power the upcoming Galaxy Watch 7 series from the company and it succeeds the W930 chip.

 

Speaking of the features, the Exynos W1000 chip is expected to give a significant boost in terms of performance and efficiency. The company has also dropped more details about the chip through its official websites.

 

The chipset is based on a 3nm fabrication process and has a 5-core CPU that has a Cortex A79 with four Cortex A55 cores. As per the official website, this will offer 2.7x faster app launches around 3.4x single-core performance, and around 3.7x multi-core performance.

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