Intel Xeon 6700E ‘Sierra Forest’ CPUs With 34 Percent More Efficiency

Intel has made some big announcements along with the launch of Xeon 6700E “Sierra Forest” CPUs with up to 144 cores. The new CPUs are the first of the new server chips featured in the Xeon 6 family.

This family will come with both P-Core and E-Core variants launching at their respective timelines and for respective platforms. Intel noted that the Xeon 6700E CPUs are optimized for performance per watt in high-density workloads. These CPUs are said to be based around an open ecosystem with an open software and open platforms approach.

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Why Did Intel Separate Xeon Lineup Into P-Core and E-Core?

The company noted that each CPU will focus on a unique workload requirement. For the Xeon E-core chips, these workloads are:

• Web & Micro-services (Clout Native / Consumer Digital Services / Application DevOps
• Database & Analytics (Unstructured Databases / Scale-Out Analytics)
• Infrastructure & Storage (Storage)
• Networking (Network Microservices / Cloud-Native CDN / 5G Core)
• Edge (Visual Protection Relay)

Intel also provided a brief layout of its performance boost with the new Xeon 67ooE lineup:

• Web & Microservices (Up To 2.6x)
• Networking (Up To 3.4x)
• Media (Up To 2.6x)
• Data Services (Up To 2.7x)

Intel wants the Xeon 6700E E-Core line to cater to data center clients who are using a 2nd Gen Xeon or older platform. The company notes that the new chip not only offers up to 4.2x faster performance and up to 2.6x perf/watt, but will enable users to save a lot of space, power, and money. A 66-rack Intel Xeon 6700E data center will offer the same performance as a 200-rack 2nd Gen Xeon-based platform while saving 84k Mwh of power.

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Intel Xeon 6700E E-Core Architectural Features

While all other features look great, it’s imperative to understand about the Xeon 6700E "Sierra Forest" E-Core family. The Xeon 6700E CPUs will offer support for LGA 4710 docketed platforms first in 1S and 2S configurations. 

This platform will come with 144 cores, up to 350W CPU TDPs, up to 8-channel DDR5-6400, and 8000 MT/s MCR DIMM support. Besides, it will have up to 88 PCIe Gen 5.0 lanes and 4 UPI 2.0 links.

Speaking of the chips, the Intel Xeon 6700E will be available only in a singular compute die configuration with dual I/O. The CPU is divided into the following aspects:

• Module-Die Fabric
• Multi-Die Architecture
• Embedded Multi-Die Interconnect Bridge